|
image
|
PART NUMBER
|
MFR
|
IN STOCK
|
PACKING
|
DATASHEET
|
DESCRIPTION
|
RFQ
|
|---|---|---|---|---|---|---|---|
 |
Analog Devices Inc.
|
22112
|
16-VFCQFN Exposed Pad
|
|
IC CLK BUFFER 1:2 14GHZ 16SMD
|
||
 |
onsemi
|
9156
|
20-TSSOP (0.173", 4.40mm Width)
|
|
IC CLK BUFF 2:1:4 LVPECL 20TSSOP
|
||
|
|
onsemi
|
4619
|
20-TSSOP (0.173", 4.40mm Width)
|
|
IC CLK BUFF 2:1:4 LVPECL 20TSSOP
|
||
 |
Renesas Electronics America Inc
|
13143
|
24-TSSOP (0.173", 4.40mm Width)
|
|
IC CLK BUFFER 2:8 350MHZ 24TSSOP
|
||
 |
Analog Devices Inc./Maxim Integrated
|
13011
|
20-TSSOP (0.173", 4.40mm Width)
|
|
IC CLK BUFFER 1:5 TSSOP
|
||
|
|
Analog Devices Inc./Maxim Integrated
|
22645
|
20-TSSOP (0.173", 4.40mm Width)
|
|
IC CLK BUFFER 2:4 TSSOP
|
||
 |
Microchip Technology
|
17847
|
8-SOIC (0.154", 3.90mm Width)
|
|
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
||
 |
Microchip Technology
|
8035
|
16-VFQFN Exposed Pad
|
|
IC CLK BUFFER 3:4 266MHZ 16QFN
|
||
 |
Microchip Technology
|
30731
|
20-TSSOP (0.173", 4.40mm Width)
|
|
IC CLK BUFFER 3:4 266MHZ 20TSSOP
|
||
|
|
Microchip Technology
|
23281
|
8-SOIC (0.154", 3.90mm Width)
|
|
IC CLK BUFFER 1:2 1GHZ 8SOIC
|
||
 |
Microchip Technology
|
23409
|
8-TSSOP (0.173", 4.40mm Width)
|
|
IC CLK BUFFER 1:2 1GHZ 8TSSOP
|
||
|
|
Microchip Technology
|
16966
|
8-TSSOP (0.173", 4.40mm Width)
|
|
IC CLK BUFFER 1:2 1GHZ 8TSSOP
|
||
 |
Microchip Technology
|
18802
|
16-TSSOP (0.173", 4.40mm Width)
|
|
IC CLK BUFFER 1:6 40MHZ 16TSSOP
|
||
|
|
Microchip Technology
|
29452
|
16-WFQFN Exposed Pad
|
|
IC CLK BUFFER 1:4 40MHZ 16QFN
|
||
 |
Microchip Technology
|
12182
|
6-UFDFN Exposed Pad
|
|
IC CLK BUFFER 1:2 40MHZ 6DFN
|
||
|
|
Microchip Technology
|
29474
|
8-SOIC (0.154", 3.90mm Width)
|
|
IC CLK BUFFER 1:1 266MHZ 8SOIC
|
||
|
|
Microchip Technology
|
18315
|
8-SOIC (0.154", 3.90mm Width)
|
|
IC CLK BUFFER 1:1 1MHZ 16SOIC
|
||
|
|
Microchip Technology
|
4808
|
8-SOIC (0.154", 3.90mm Width)
|
|
IC CLK BUFFER 1:1 1MHZ 16SOIC
|
||
|
|
Microchip Technology
|
25964
|
16-WFQFN Exposed Pad
|
|
IC CLK BUFFER 1:1 1MHZ 33QFN
|
||
|
|
Microchip Technology
|
5334
|
16-WFQFN Exposed Pad
|
|
IC CLK BUFFER 1:1 1MHZ 33QFN
|
||
|
|
Microchip Technology
|
21769
|
8-SOIC (0.154", 3.90mm Width)
|
|
IC CLK BUFFER 1:1 200MHZ 8SOIC
|
||
|
|
Microchip Technology
|
15913
|
8-SOIC (0.154", 3.90mm Width)
|
|
IC CLK BUFFER 1:1 200MHZ 8SOIC
|
||
|
|
Microchip Technology
|
18346
|
8-TSSOP (0.173", 4.40mm Width)
|
|
IC CLK BUFFER 1:1 200MHZ 8TSSOP
|
||
|
|
Microchip Technology
|
14335
|
8-TSSOP (0.173", 4.40mm Width)
|
|
IC CLK BUFFER 1:1 200MHZ 8TSSOP
|
||
 |
Microchip Technology
|
11396
|
32-LQFP Exposed Pad
|
|
IC CLK BUFFER 2:9 700MHZ 32LQFP
|
||
|
|
Microchip Technology
|
21393
|
32-LQFP Exposed Pad
|
|
IC CLK BUFFER 2:10 700MHZ 32LQFP
|
||
|
|
Microchip Technology
|
29677
|
8-SOIC (0.154", 3.90mm Width)
|
|
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
||
|
|
Microchip Technology
|
10496
|
32-LQFP Exposed Pad
|
|
IC CLK BUFFER 2:9 700MHZ 32LQFP
|
||
|
|
Microchip Technology
|
11396
|
16-VFQFN Exposed Pad
|
|
IC CLK BUFFER 3:4 266MHZ 16QFN
|
||
|
|
Microchip Technology
|
25517
|
20-TSSOP (0.173", 4.40mm Width)
|
|
IC CLK BUFFER 3:4 266MHZ 20TSSOP
|